发明名称 |
Semiconductor device package with improved cooling |
摘要 |
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom. The metal clip or drain clip has a plurality, a parallel spaced fins extending from its outwardly facing surface.
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申请公布号 |
US6784540(B2) |
申请公布日期 |
2004.08.31 |
申请号 |
US20020267142 |
申请日期 |
2002.10.08 |
申请人 |
INTERNATIONAL RECTIFIER CORP. |
发明人 |
CARDWELL CHARLES S. |
分类号 |
H01L23/34;H01L23/31;H01L23/367;H01L23/373;H01L23/433;H01L23/492;(IPC1-7):H01L23/24;H01L23/14;H01L23/10 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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