发明名称 |
Method of assembling a multi-chip device |
摘要 |
A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed. |
申请公布号 |
US6782611(B2) |
申请公布日期 |
2004.08.31 |
申请号 |
US19990398652 |
申请日期 |
1999.09.17 |
申请人 |
INTEL CORPORATION |
发明人 |
SAMARAS WILLIAM A.;PHILLIPS PAUL T.;BROWNELL MICHAEL P. |
分类号 |
H01L23/498;H01L25/16;H05K1/02;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):H05K3/32 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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