发明名称 Methods for forming aligned fuses disposed in an integrated circuit
摘要 An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.
申请公布号 US6784043(B2) 申请公布日期 2004.08.31
申请号 US20030367287 申请日期 2003.02.14
申请人 MICRON TECHNOLOGY, INC. 发明人 CARSON BRYAN C.;HADZOR MARK L.;BISSEY LUCIEN J.
分类号 G11C17/14;G11C29/00;(IPC1-7):H01L21/823 主分类号 G11C17/14
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