| 发明名称 |
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 摘要 |
A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
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| 申请公布号 |
US6784088(B2) |
申请公布日期 |
2004.08.31 |
| 申请号 |
US20030345288 |
申请日期 |
2003.01.16 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDELSTEIN DANIEL C.;KANG SUNG KWON;MCGLASHAN-POWELL MAURICE;O'SULLIVAN EUGENE J.;WALKER GEORGE F. |
| 分类号 |
H01L21/288;H01L21/60;H01L21/768;H01L23/532;H05K3/24;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/288 |
| 代理机构 |
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