发明名称 |
Resist ink composition |
摘要 |
The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable of initiating cationic polymerization under irradiation by an active energy ray and/or under heat. This resist ink composition has high photosensitivity and enables the final curing by a brief heating and the cured film exhibits good physical properties.
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申请公布号 |
US6783840(B2) |
申请公布日期 |
2004.08.31 |
申请号 |
US20010959522 |
申请日期 |
2001.10.29 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
WATANABE TAKEO;SATO TAKASHI;TAGOSHI HIROTAKA |
分类号 |
G03F7/038;H05K1/00;H05K3/28;(IPC1-7):C08G65/26;C08G1/54;C08G1/73;B32B27/00 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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