| 发明名称 |
WAFER DICING/BONDING SHEET AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>THE WAFER DICING/BONDING SHEET OF THE PRESENT INVENTION COMPRISES A SOFT FILM, A PRESSURE SENSITIVE ADHESIVE LAYER FORMED ON THE SOFT FILM, A PROCESSING FILM FOR POLYIMIDE TYPE RESIN COMPOSED OF A HEAT RESISTANT RESIN WHICH HAS BEEN FORMED ON THE PRESSURE SENSITIVE ADHESIVE LAYER AND A POLYIMIDE ADHESIVE LAYER FORMED ON THE PROCESSING FILM. IT IS PREFERRED THAT THE PROCESSING FILM BE A POLYETHYLENE NAPHTHALATE FILM WHOSE SURFACE HAS BEEN SUBJECTED TO AN ALKYD RELEASE TREATMENT. THE PRESENT INVENTION FACILITATES EXPANSION TO BE CONDUCTED AFTER THE WAFER DICING. (FIG. 4)</p> |
| 申请公布号 |
MY118036(A) |
申请公布日期 |
2004.08.30 |
| 申请号 |
MY1997PI00194 |
申请日期 |
1997.01.18 |
| 申请人 |
LINTEC CORPORATION |
发明人 |
NORITO UMEHARA;MASAZUMI AMAGAI;MAMORU KOBAYASHI;KAZUYOSHI EBE |
| 分类号 |
B32B27/06;H01L21/208;H01L21/301;H01L21/304;H01L21/68;H01L23/495 |
主分类号 |
B32B27/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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