| 摘要 |
A METHOD AND A CIRCUIT BOARD FOR ASSEMBLING ELECTRONIC DEVICES(10). THE CIRCUIT BOARD COMPRISES A PLURALITY OF SOLDERING PADS(31) FOR SOLDERING CONTACTS OF ELECTRONIC DEVICES(10), AND AT LEAST AN INSULATED ZONE(32) NEIGHBORING AT LEAST ONE OF THE SOLDERING PADS(31), FROM WHICH SOLDERING PASTE(33) IS EXTENDIBLE TO AT LEAST A PORTION OF THE INSULATED ZONE(32) WHILE APPLYING SOLDERING PASTE(33). THE METHOD INCLUDES THE STEPS OF APPLYING SOLDERING PASTE(33) ONTO AT LEAST A PORITION OF THE SOLDERING PADS(31) ALLOWING THE SOLDERING PASTE(33) TO EXTEND OUTWARDLY FROM AT LEAST ONE SOLDERING PAD(31) TO LOCATION NOT IN CONTAC WITH OTHER SOLDERING PAD(31) OR TRACES, OR TO AT LEAST APORYIAN OF INSULATED ZONE(32)NEIGNBORING THE SOLDERING PAD(31); AND SOLDERING CONTACTS OF ELECTRONIC DIVECES(10) TO THE CIRCUIT BOARD HAVING THE PORTION OF SOLDERING PADS(31) INCLUDING THE AT LEAST ONE SOLDERING PAD (31). (FIG.3G)
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