| 摘要 |
PURPOSE: A vapor deposition device is provided which is capable of forming a uniformed material deposition film on the whole surface of the substrate by converting flow of material vapor discharged from evaporation source perpendicularly to the surface of substrate. CONSTITUTION: The vapor deposition device comprising an evaporation source(10) for transferring heat to a deposition material contained in the evaporation source and forming a deposition film on the surface of substrate(20) positioned in an upper part of the evaporation source by discharging vapor of the deposition material produced in the evaporation source, the vapor deposition device further comprises a means installed between the evaporation source and the substrate to convert flow of material vapor discharged from the evaporation source perpendicularly to the whole surface of the substrate, wherein the means for converting flow of the material vapor discharged from the evaporation source perpendicularly to the whole surface of the substrate is a guider(30) formed of a member having a certain thickness installed with being parallel to the substrate, and a plurality of through holes(31C,31O) perpendicularly penetrating to component member are formed on the guider, wherein dimensions (sectional area) of through holes formed on an outer part of the guider is larger than dimensions (sectional area) of through holes formed on a central part of the guider, and wherein a power supply is connected to the guider, and the substrate is grounded so that an electric field is formed in a space between the substrate and the guider, and a means for ionizing the material vapor discharged is installed on an upper part of the evaporation source to accelerate flow of the material vapor and increase straightness of the material vapor by an electric field formed in a process that the ionized material vapor reaches the substrate through the guider after the material vapor discharged from the evaporation source is ionized.
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