| 摘要 |
Wafers (26) are prevented from getting damaged on delivery thereof from a sucking and carrying device to a table (48, 52, 54). A wafer (26) before planarization sucked and held by a sucking board (68, 80) is positioned above a table (48, 52, 54). Next, wafer (26) is vacuum-attracted by the table (48, 52, 54), and the table (48, 52, 54) is moved upward by that attraction power in a direction to suck the wafer (26) so as to vacuum-suck it on the table (48, 52, 54). Subsequently, the wafer (26) is sucked and held only by the table (48, 52, 54) by releasing the sucking and holding thereof by the sucking board (68, 80). <IMAGE> |
