| 发明名称 |
LINKAGE GUIDED BOND HEAD |
| 摘要 |
<p>A bond head for use with a bonding machine. The bond head has an arm assembly; and a linkage coupled between the arm assembly and the frame of the bonding machine. The linkage forms a virtual pivot point below a lower surface of the arm assembly.</p> |
| 申请公布号 |
SG105473(A1) |
申请公布日期 |
2004.08.27 |
| 申请号 |
SG20000006370 |
申请日期 |
2000.11.07 |
| 申请人 |
KULICKE AND SOFFA INVESTMENTS, INC |
发明人 |
SADLER, RICHARD D. |
| 分类号 |
H01L21/60;B23K20/00;(IPC1-7):H01L21/60;B23K37/02 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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