发明名称 |
Electronic device and a method of manufacturing the same |
摘要 |
A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a thermo-compression bonding tool with an adhesive resin interposed between a first area of the one main surface of the wiring board and the first electronic component, and a second electronic component mounted on a second area different from the first area of the one main surface of the wiring board by melting a soldering paste material and higher than the first electronic component in post-mounting height, and wherein the first electronic component is mounted before the mounting of the second electronic component.
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申请公布号 |
US2004166608(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20040790057 |
申请日期 |
2004.03.02 |
申请人 |
RENESAS TECHNOLOGY CORP.;HITACHI HOKKAI SEMICONDUCTOR, LTD. |
发明人 |
NAKAMURA SHIGERU |
分类号 |
H05K3/32;H01L21/60;H01L21/603;H01L25/04;H01L25/18;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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