发明名称 THIN FILM PATTERN FORMING SYSTEM AND ELECTRONIC CIRCUIT SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a thin film pattern forming system securing high reflexivity, high adhesiveness and thermal stability of a reflective film. SOLUTION: The thin film pattern forming system of the present invention is provided with a means forming the reflective film of a metallic material having high reflexivity including an adhesive material in advance, on a substrate. By using this system, an adhesive material layer having only a required amount of the adhesive as the adhesive layer can be formed on a reflective film surface, to avoid lowering of light reflectance caused by the formation of an excessive amount of the adhesive material layer on the reflective film surface, and to secure adhesive strength of the reflective film. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004240147(A) 申请公布日期 2004.08.26
申请号 JP20030028879 申请日期 2003.02.05
申请人 OSAKA INDUSTRIAL PROMOTION ORGANIZATION 发明人 SATO RYOHEI;IWATA KOJI;YOKOTA KOICHI
分类号 G02B6/13;G02B6/122;(IPC1-7):G02B6/13 主分类号 G02B6/13
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