METHOD OF MANUFACTURING MULTILAYERED BOARD AND METHOD OF MANUFACTURING CIRCUIT DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To carry out an exposure process by the use of a resin sheet 10 where an opening 11 is bored and to laminate a multilayered conductive film 15 through the intermediary of the resin sheet 10. SOLUTION: A negative photosensitive resist 16 is applied on the surface of a first conductive film 15A, the resist 16 is subjected to exposure using the resin sheet 10 with the openings 11 as a mask, and the resist 16 is left unremoved at spots corresponding to the openings 11. The first conductive film 15A is subjected to etching using the residual resist 16 as a mask to form projecting joints 17. The resin sheet 10 is laminated on the first conductive film 15A fitting the joints 17 into the openings 11. Furthermore, a second conductive film 15B is laminated on the resin sheet 10 for the formation of a multilayered board 20. COPYRIGHT: (C)2004,JPO&NCIPI