发明名称 Lanthanide doped TiOx dielectric films
摘要 A dielectric film containing lanthamide doped TiOx and a method of fabricating such a dielectric film produce a reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO2. A dielectric film is formed by ion assisted electron beam evaporation of TiO2 and electron beam evaporation of a lanthamide selected from a group consisting of Nd, Tb, and Dy. The growth rate is controlled to provide a dielectric film having a lanthamide content ranging from about ten to about thirty percent of the dielectric film. These dielectric films containing lanthamide doped TiOx are amorphous and thermodynamically stable such that the lanthamide doped TiOx will have minimal reactions with a silicon substrate or other structures during processing.
申请公布号 US2004164365(A1) 申请公布日期 2004.08.26
申请号 US20040789044 申请日期 2004.02.27
申请人 MICRON TECHNOLOGY, INC. 发明人 AHN KIE Y.;FORBES LEONARD
分类号 C23C14/08;C23C14/54;H01L21/28;H01L21/316;H01L21/8242;H01L29/51;(IPC1-7):H01L29/04;H01L31/062 主分类号 C23C14/08
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