| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive pattern in which the yield concerning via deviation can be improved even with the same design specification, and to provide a printed wiring board. SOLUTION: The conductive pattern 3 connecting respective layers in the printed wiring board is made to be a polygon, a rectangle and an octagon, for example. Thus, an area of a via deviation tolerance 4 of a via 1 with respect to the conductive pattern 3 is made to be larger than a case when the shape of the conductive pattern is circular. The yield concerning via deviation can be improved even with the same design specification and reliability improves. COPYRIGHT: (C)2004,JPO&NCIPI |
