ELECTRONIC PART JOINING SUPPLEMENTARY INSTRUMENT, JOINING ELECTRONIC PART, ELECTRONIC PART JOINING INTERMEDIATE SUBSTRATE, AND ELECTRONIC PART JOINING METHOD

摘要

PROBLEM TO BE SOLVED: To heighten the packaging density of electronic parts by dip soldering. SOLUTION: This electronic part joining supplementary instrument 1 includes fixing members 5 and leading members 3a to 3d that are detachable to/from the electronic part E. The leading member has affinity to a metal joining material. When the fixing members are attached to the electronic part to form a joining electronic part 7 and then the joining electric part 7 brings a substrate land into contact with a lead of the corresponding electronic part, the electronic part joining supplementary instrument 1 contacts closely the substrate. When the molten metal joining material is fed, and the redundant molten metal material is separated from the leading member to remove the material from the lead. COPYRIGHT: (C)2004,JPO&NCIPI