发明名称 TEMPERATURE CONTROL METHOD OF SEMICONDUCTOR MANUFACTURING EQUIPMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a temperature control method of a semiconductor manufacturing equipment making a precise temperature control of the semiconductor manufacturing equipment with the use of a plurality of induction heating coils. SOLUTION: Of the temperature control method of the semiconductor manufacturing equipment using heating coils 10 consisting of a plurality of zones, a degree of interference of magnetic flux with a susceptor 12 is preliminarily found. A current value required by each heating coil 10 for generating an amount of heat needed by each zone of the susceptor 12 is calculated. A current corresponding to the above current value is inputted to each heating coil 10. Further, each heating coil 10 with the required current inputted synchronizes or holds within a preset range a frequency/current phase, and makes the temperature control in response to the inputted power. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004241302(A) 申请公布日期 2004.08.26
申请号 JP20030030935 申请日期 2003.02.07
申请人 MITSUI ENG & SHIPBUILD CO LTD 发明人 UCHIDA NAOKI;INAMI SHOICHI;MIYATA JUNYA;OZAKI KAZUHIRO
分类号 H05B6/06;H01L21/205;(IPC1-7):H05B6/06 主分类号 H05B6/06
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