COMPOSITION AND METHOD FOR LOW TEMPERATURE DEPOSITION OF SILICON-CONTAINING FILMS

摘要

Silicon precursors for forming silicon-containing films in the manufacture of semiconductor devices, such as low dielectric constant (k) thin films, high k gate silicates, low temperature silicon epitaxial films, and films containing silicon nitride (Si3N4), siliconoxynitride (SiOxNy ) and/or silicon dioxide (SiO2). The precursors of the invention are amenable to use in low temperature (e.g., < 500°C or <300°C) chemical vapor deposition processes, for fabrication of ULSI devices and device structures.