| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of circuit board wherein heat dissipating efficiency of a circuit board is increased. SOLUTION: A circuit board unit 1 is constituted by collectively attaching a circuit board 2, a shield plate 3 and a shield case 4 to one piece. The shield plate 3 is provided with a protrusion 6 of convex at a circuit board 2 side to attach. The protrusion 6 is provided with a taper-shaped side wall and an annular end wall, and attached in such a manner that a rectangular-like copper foil 11 which is formed by exfoliating resin of the surface of the circuit board 2 abuts against the end wall. Heat of the circuit board 2 is conducted to the protrusion 6 through the copper foil 11. The protrusion 6 has a window 8 as a hole which is formed by notching the side wall of the protrusion 6, and heat between the circuit board 2 and the shield plate is dissipated outside through the window 8. COPYRIGHT: (C)2004,JPO&NCIPI
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