| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method of a semiconductor device which enables electroplating of an electrode in the semiconductor device. SOLUTION: In the electroplating method, the surface of an anode is composed of a metal more noble than bismuth, and an article to be plated is placed as a cathode. Here, plating current is applied using a solution containing tin and bismuth as an electrolyte. COPYRIGHT: (C)2004,JPO&NCIPI
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