| 摘要 |
A chip resistor includes an insulating substrate 2 in the form of a chip having an upper surface and an opposite pair of side surfaces, a resistor film 4 formed on the upper surface of the insulating substrate 2, a pair of upper electrodes 5 formed on the upper surface of the insulating substrate 2 to flank the resistor film 4 in electrical connection thereto, a cover coat 6 covering the resistor film 4, an auxiliary upper electrode 7 formed on each of the upper electrodes 5 and including a first portion 7a adjoining the relevant side surface of the insulating substrate 2 and a second portion 7b overlapping the cover coat 6, and a side electrode 8 formed on each of the side surfaces of the insulating substrate 2 and electrically connected to at least the upper electrode 5 and the auxiliary upper electrode 7. The first portion 7a of the auxiliary upper electrode 7 has an obverse surface positioned higher than an obverse surface of the second portion 7b for projecting above an obverse surface of the cover coat 6.
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