发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a treatment method capable of securely treating the inside of a depression such as a trench, a contact hole, a deep pattern, or the pore of a porous substrate. SOLUTION: A chemical solution M is fed into an airtight treatment tank 1 accommodating a substrate W, and the inside of the treatment tank 1 is repetitively decompressed and pressurized at the atmospheric pressure or lower several times. Alternatively, alcohol X is brought into contact with the surface of the substrate W, and the alcohol X is allowed to enter a depression W-1. The chemical solution M is fed into the treatment tank 1 accommodating the substrate W up to the water level at which the substrate W is dipped, and the chemical solution M is allowed to enter the depression W-1. The chemical solution M is drained from the treatment tank 1 to decompress the inside of the processing tank 1. Thereby, a part of the chemical solution M entering the depression W-1 and mixed with the alcohol X is evaporated. Such treatment is repeated several times. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004241754(A) 申请公布日期 2004.08.26
申请号 JP20030169819 申请日期 2003.06.13
申请人 CHEM ART TECHNOL:KK;CANON INC 发明人 WATABE HIROSHI;MESAKI TAMOTSU;KIDO SHIGERU;SAKAGUCHI KIYOBUMI
分类号 B08B3/04;B08B3/10;H01L21/00;H01L21/30;H01L21/304;H05K3/26;(IPC1-7):H01L21/304 主分类号 B08B3/04
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