| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching liquid and an etching method by which side etch is effectively suppressed even in an extremely small addition amount, and a satisfactory etch factor is realized, and to provide technology of producing a printed circuit board, a lead frame, a TAB and a BGA in fine pitches enabling high density packaging, or a high precision shadow mask. SOLUTION: The etching liquid having a liquid composition of cupric chloride and hydrochloric acid, or ferric chloride and hydrochloric acid for etching a metallic material as the object to be worked, contains two or more organic additives having a corrosion inhibition action on metals, composed of a polyethylene glycol derivative shown by R<SB>1</SB>O-(CH<SB>2</SB>CH<SB>2</SB>O)n(CH<SB>2</SB>CH<SB>2</SB>)m-H(R=H or a 1 to 50C alkyl group) in which the polymerization degree n in the oxyethylene part is 1 to 120, the polymerization degree m in the ethylene part is 2 to 180, and the molecular weight is 500 to 10,000, and the wax or rust preventing oil of lipophilic hydrocarbons. The etching method uses the etching liquid. COPYRIGHT: (C)2004,JPO&NCIPI
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