| 摘要 |
A modular implantable medical device (101, 201, 301, 401, 501, 601, 701, 801) includes two or more interconnected modules (103-105, 210-212, 410-412, 510-512, 610, 710-712, 810, 910) and an overmold (106, 214, 302, 413, 522, 622, 722, 822) that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module (213A-B, 303A-B, 415A-B, 613, 813) for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.
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