SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE ASSEMBLY, PRINCIPAL CIRCUIT CONSTITUTING COMPONENT, AND POWER CONVERTING CIRCUIT

摘要

PROBLEM TO BE SOLVED: To realize, at a low cost, a power converting circuit in accordance with the required capacitance using a plurality of resin-molded semiconductor module units. SOLUTION: The semiconductor module 100 is made to have a structure that a rectangular parallelopiped resin mold 10 is formed by mounting and resin-molding a switching element and a free wheel diode as the principal circuit elements on the common substrate, a first principal circuit terminal 3 and a second principal circuit terminal 4 of the switching element are protruded from one side surface of the resin mold 10, and a signal terminal group is protruded from the opposite side surface of the resin mold. Two semiconductor modules 100 is constituted to be a set of semiconductor module assembly 301 while holding a cooling device 20 between the modules. By having this semiconductor module assembly 301 as a structural unit and arranging the assemblies by the number of sets corresponding to the capacity in parallel, and arranging the assemblies by a required number of phases in parallel a principal circuit 401 of capacities and number of phases required is formed. COPYRIGHT: (C)2004,JPO&NCIPI