| 摘要 |
PROBLEM TO BE SOLVED: To provide a tin-plating bath which inexpensively and easily satisfies packaging characteristics and solder wettability. SOLUTION: The tin-plating bath includes a stannous salt, a complexing agent, and at least one compound selected from polyoxyethylenealkylamines and polyoxyethylenealkylamides, the compound having a 6-18C alkyl group and a total number of moles of ethylene oxide added of 12-80. The tin-plating bath has a hydrogen ion exponent pH of 5.0 to 7.0, and its bath temperature is controlled to lower than 40°C. COPYRIGHT: (C)2004,JPO&NCIPI
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