发明名称 COOLING DEVICE WITH SUBCOOLING SYSTEM
摘要 A cooling device (10) with a subcooling system (30) is disclosed, where the cool ing device has a closed loop refrigerant cycle (22) containing a refrigerant, in cluding a heat exchanger (34) communicating with the closed loop refrigerant cycle and communicating with a fluid, the heat exchanger configured to selectively receive and cool the refrigerant from the closed loop refrigerant cycle when the refrigerant temperature is greater than the coolant temperature; and a fluid receiving device configured to receive the fluid that is warmed in the heat exchanger. A modular system (60, fig 2A) for providing a refrigerant to a cooling device (110, fig 2A) at an installation location is also disclosed and includes a transportable enclosure having at least one compressor (112, fig 2A), a condenser (114, fig 2A) and a piping system (122, fig 2A) for conveying the refrigerant in a closed loop cycle, where the piping system includes portions (82, fig 2A) configured to be coupled to the cooling device at the installation location.
申请公布号 WO2004015338(A3) 申请公布日期 2004.08.26
申请号 WO2003US25340 申请日期 2003.08.12
申请人 DELAWARE CAPITAL FORMATION, INC.;MARTIN, JON, SCOTT 发明人 MARTIN, JON, SCOTT
分类号 F25B29/00;F25B40/02;F25B49/02 主分类号 F25B29/00
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