摘要 |
A cooling device (10) with a subcooling system (30) is disclosed, where the cool ing device has a closed loop refrigerant cycle (22) containing a refrigerant, in cluding a heat exchanger (34) communicating with the closed loop refrigerant cycle and communicating with a fluid, the heat exchanger configured to selectively receive and cool the refrigerant from the closed loop refrigerant cycle when the refrigerant temperature is greater than the coolant temperature; and a fluid receiving device configured to receive the fluid that is warmed in the heat exchanger. A modular system (60, fig 2A) for providing a refrigerant to a cooling device (110, fig 2A) at an installation location is also disclosed and includes a transportable enclosure having at least one compressor (112, fig 2A), a condenser (114, fig 2A) and a piping system (122, fig 2A) for conveying the refrigerant in a closed loop cycle, where the piping system includes portions (82, fig 2A) configured to be coupled to the cooling device at the installation location. |