发明名称 |
Electronic component placement machine and electronic component placement method |
摘要 |
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
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申请公布号 |
US2004163243(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20040781787 |
申请日期 |
2004.02.20 |
申请人 |
NODA KAZUHIKO;MUKOJIMA HITOSHI;NARIKIYO YASUHIRO;HIRAKAWA TOSHIRO;KANAKI HIROMI;NISHIMURA AKIRA;UCHIDA OSAMU;ISHIKAWA TAKATOSHI |
发明人 |
NODA KAZUHIKO;MUKOJIMA HITOSHI;NARIKIYO YASUHIRO;HIRAKAWA TOSHIRO;KANAKI HIROMI;NISHIMURA AKIRA;UCHIDA OSAMU;ISHIKAWA TAKATOSHI |
分类号 |
H05K13/04;H05K13/08;(IPC1-7):H05K3/30;B23P19/00 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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