| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive rein composition which produces little residue at development removing part to enable a pixel having excellent flatness to be manufactured from the composition and little contaminates a baking furnace. <P>SOLUTION: The photosensitive resin composition has a binder resin (b), a photopolymerizable compound (c), a photopolymerization initiator (d), a solvent (f) and at least one kind of monomer from which the constituent of the binder resin (b) is derived, wherein the monomer is contained in a mass fraction of 0.010 to 0.16% by mass to the solid content of the photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
