| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a composite material which has higher thermal conductivity and higher strength than those of wire net and is suitable for a heat dissipation substrate on which an electronic component such as a semiconductor device is mounted. SOLUTION: To manufacture a composite material 11, an expand metal 12 is placed between metal plates 13, then the expand metal 12 and the metal plates 13 are heated and rolled by reduction rolls 14 so that they are joined and united. Rolling and joining are performed not in a single-step operation but in a two-step operation. In a first step, the metal plates 13 are partly charged into openings of meshes 12a of the expand metal 12. In a second step, rolling to a predetermined thickness and the joining of the expand metal 12 and the metal plates 13 are performed. A rolling ratio is desirably 30% or higher though it is determined in consideration of the thickness of the finished plate. COPYRIGHT: (C)2004,JPO&NCIPI |
