| 发明名称 |
LED OPTICAL SOURCE, LED ILLUMINATION DEVICE AND LED DISPLAY DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the adhesive strength of a reflecting plate in an LED optical source where the reflecting plate is bonded to a printed board. <P>SOLUTION: The LED optical source is provided with a plurality of LED bare chips C11, C12 to C18, and the like, which are mounted on the printed board 22 and with the reflecting plate 24 which has reflection holes formed in accordance with the respective LED bare chips and which is bonded to the printed board 22 through a bonding layer 50. A part (46A, 46B, 46C and the like) of a conductor pattern connecting the LED bare chips is formed at the substrate so that it bypasses a bonding face with the reflecting plate 24. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004241509(A) |
申请公布日期 |
2004.08.26 |
| 申请号 |
JP20030027678 |
申请日期 |
2003.02.04 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
TAMURA TETSUSHI;SETOMOTO TATSUMI;MATSUI NOBUYUKI;TANIMOTO NORIYASU;SHIMIZU MASANORI |
| 分类号 |
F21V19/00;F21S8/04;F21V5/04;F21Y101/02;H01L33/48;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
F21V19/00 |
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