发明名称 OPTICAL SEMICONDUCTOR ELEMENT SEALING RESIN
摘要 <P>PROBLEM TO BE SOLVED: To obtain an optical semiconductor element sealing resin which maintains the luminance high when the optical semiconductor element to be sealed is a light-emitting element, maintains the photo-detecting sensitivity high when it is a photo-detecting element, furthermore can simply seal the optical semiconductor element, and excels in economy, and to provide an optical semiconductor device having excellent performance obtained by sealing an optical semiconductor element with the use of the resin, and a method for manufacturing the device with high efficiency. <P>SOLUTION: The optical semiconductor element sealing resin is composed of a polycarbodiimide having a specific structure. The optical semiconductor device is obtained by sealing the optical semiconductor element with the use of the optical semiconductor element sealing resin. The method for manufacturing the optical semiconductor device comprises a step of placing the optical semiconductor sealing resin on the optical semiconductor element and heating the resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004238441(A) 申请公布日期 2004.08.26
申请号 JP20030027207 申请日期 2003.02.04
申请人 NITTO DENKO CORP 发明人 UWADA KAZUTAKA;HOTTA YUJI;SADAYORI NAOKI
分类号 C08G18/02;C08G18/79;C08G73/00;C09D5/25;H01L23/29;H01L23/31;H01L33/08;H01L33/30;H01L33/54;H01L33/56;H01L33/62 主分类号 C08G18/02
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