| 摘要 |
PROBLEM TO BE SOLVED: To provide a gang printing wiring board that can be divided accurately into many wiring board regions along the boundary lines of the regions without being bent largely at the time of cutting the mother board. SOLUTION: This wiring board of multiple allocation contains the mother substrate 6 provided with a substrate 4 with metal foil constituted by alternately laminating insulating layers 1 formed by impregnating an allyl-modified polyphenylene ether resin into a heat-resistant fibrous base material and metal foil 2 upon another, and grinding its main surface in which metal foil 2 is embedded and insulating resin layers 8 composed of an epoxy resin and laminated upon the ground main surface of the substrate 4. In the central part of the mother substrate 6, many wiring board regions 9 having wiring conductors 7 each composed of metal foil 2 and solder-resistant resin layers 8 composed of the insulating resin layers 8 are provided and, at the same time, a metallic frame 10 surrounding the wiring board regions 9 and composed of metal foil 2 is provided separately from the outer periphery of the substrate 4 in the outer peripheral section of the polished main surface of the substrate 4. COPYRIGHT: (C)2004,JPO&NCIPI |
