| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board using conductive paste whose electric characteristics are excellent by forming protrusions having shapes and sizes suitable for improving inter-layer electric connection with the high degree of freedom without generating the sharp increase of costs, and reducing the electric resistance of a multi-layer connecting electric circuit. SOLUTION: A conductive layer 12 is provided with a protrusion 17 formed by a print method at a land 16 brought into contact with conductive paste 15 packed in a via hole 14 in the other layer, and when base materials are attached for multi-layering, the protrusion 17 is made to sink into the conductive paste 15 of the corresponding via hole 14 in the other layer. COPYRIGHT: (C)2004,JPO&NCIPI |
