| 摘要 |
PROBLEM TO BE SOLVED: To accelerate the speed of the movement cycle of a die bonding apparatus, while reducing its cost. SOLUTION: The die bonding apparatus has a first movement mechanism 45 for performing a first movement cycle wherein, after moving a lead frame 33 every predetermined pitch to a delivery position 44 present on a downstream by receiving it by a first arm 28, the first arm 28 is moved in a lifted state to a lead-frame receiving position to be lowered. Also, the die bonding apparatus has a second movement mechanism 75 for performing a second movement cycle wherein, after moving the lead frame 33 moved by the first movement mechanism 45 every predetermined pitch to an ending position 74 present on the downstream by receiving it by a second arm 59, the second arm 59 is moved to an acceptance position 73 to be lowered. Further, a second feeding claw 61 of the second arm 59 comprises an upstream engagement claw 81 which is engaged in the acceptance position 73 with a hole 34 of the lead frame 33 sent from the first movement mechanism 45 and a downstream engagement claw 82 which is engaged with the hole 34 of the lead frame 33 moved by the second movement mechanism 75. COPYRIGHT: (C)2004,JPO&NCIPI
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