METHOD OF FORMING WIRING METAL LAYER AND WIRING METAL LAYER

摘要

PROBLEM TO BE SOLVED: To provide a method of forming wiring metal layer in a selected area of a substrate, and a wiring metal layer. SOLUTION: The method of forming wiring metal layer is a method of forming a wiring metal layer 30 in a selected area of a substrate 10. The method includes a step of making the area 16 on the substrate hydrophilic while making the other area hydrophobic, a step of agglutinating a dispersed solution containing microparticles 26 of a metal or a metal oxide on at least the hydrophilic area, which are protected by an organic substance 28 having a hydrophilic group in its molecule, and thereafter drying, and a step of binding the microparticles of the metal or the metal oxide. COPYRIGHT: (C)2004,JPO&NCIPI