| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device capable of removing foreign matters on a copper surface without the need of executing complicated processes. SOLUTION: An object to be processed is prepared in which copper or a material whose main component is the copper occupies at least a part of a surface. The surface of the object to be processed is exposed to a gas containing steam and the anticorrosive of the copper to clean the surface. COPYRIGHT: (C)2004,JPO&NCIPI
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