Production of a component with a semiconductor support used in micro-electronics comprises etching recesses in a porous material to form a thermally coupled region defined by the recesses, and forming a structure over one region

摘要

Production of a component with a semiconductor support (1) comprises etching recesses (5) in a porous material (3) to form a thermally coupled region defined by the recesses, and forming a structure over one region. An independent claim is also included for a component with a semiconductor support (1) produced by the above method.