| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive which is usable for at least three months at 25°C without deteriorating low elasticity, heat resistance and moisture resistance which are required in packaging a semiconductor chip onto a wiring board, called an interposer, such as a glass-epoxy board, a flexible board, having a thermal expansion coefficient largely differ from that of the chip. SOLUTION: The adhesive contains (1) 100 pts.wt. epoxy resin and its curing agent, (2) 75-300 pts.wt. epoxy group-containing acrylic copolymer containing 0.5-6 wt.% glycidyl (meth)acrylate and having a Tg (glass transition temperature) of -10°C or higher and a weight average molecular weight of at least 800,000, and (3) 0.1-20 pts.wt. latent curing accelerator. COPYRIGHT: (C)2004,JPO&NCIPI |
