SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To realize a three-dimensional mounting structure of different types of packages.

SOLUTION: Carrier substrates 21 and 31 are mounted on a carrier substrate 11 by making the end sections of the carrier substrates 21 and 31 disposed on a semiconductor chip 13 by respectively joining projecting electrodes 24 and 36 to lands 12c provided on the carrier substrate 11.

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