| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board having a fine conductive circuit efficiently at a low cost, and also to provide a multilayer circuit board manufactured by the same. SOLUTION: The method of manufacturing a multilayer circuit board includes a process wherein a process of forming an insulating resin layer having an opening on a supporting body or a circuit board by an ink jet method, and then forming a circuit pattern on the insulating resin layer by the ink jet method using conductive paste is repeated at least once. COPYRIGHT: (C)2004,JPO&NCIPI |
