| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition suitable for a printed wiring board having a high Tg and excellent adhesion, and a prepreg for a printed wiring board, metal-clad laminate and multilayer printed wiring board using the composition. SOLUTION: This resin composition comprises (A) a high-molecular-weight epoxy resin having a weight-average molecular weight of≥5,000 and≤50,000, (B) a low-molecular-weight epoxy resin having a weight-average molecular weight of≥250 and <5,000, (C) a polycondensate of a phenol and formaldehyde, and (D) dicyandiamide, wherein the component (A) is 1-20 wt.% and the component (D), 0.01-0.15 wt.% of the total amount of the composition. COPYRIGHT: (C)2004,JPO&NCIPI |
