MULTILAYER PRINTED WIRING BOARD AND ITS PRODUCING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a reliable multilayer printed wiring board and its producing process. SOLUTION: In the multilayer printed wiring board where at least two wiring layers are formed on an insulating substrate through an insulating layer and the wiring layers are connected electrically through IVH (interstitial via hole) filled with a buried resin layer, the insulating layer is formed by laminating and thermosetting a prepreg produced by impregnating a glass cloth with semi-curing resin exhibiting percentage elongation of 10% or above after curing, or a prepreg composed of semi-curing resin exhibiting percentage elongation of 10% or above after curing. COPYRIGHT: (C)2004,JPO&NCIPI