| 摘要 |
PROBLEM TO BE SOLVED: To provide a dip formed article which has a low surface resistivity, a lower surface resistivity than the conventional articles even after being washed with ultrapure water, a sufficient thickness as a dip formed article, and excels in the uniformity of the film thickness, and to obtain a coagulant composition for dip forming which gives the dip formed article. SOLUTION: The coagulant composition for the dip forming is composed of an aqueous medium, a dip forming coagulant, and a cationic surface active agent and contains, based on the total amount of these components, 1-5 wt.% dip forming coagulant and 0.1-2 wt.% cationic surface active agent. COPYRIGHT: (C)2004,JPO&NCIPI |
