| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave filter, especially the one which miniaturizes a package dimension and has high quality. SOLUTION: In the surface acoustic wave filter of a structure where an IDT for propagating a surface acoustic wave and a bonding pad which is electrically conducted with the IDT are formed on a main surface of a piezoelectric substrate and a surface acoustic wave filter element providing the piezoelectric substrate with an absorber for absorbing an unnecessary wave is flip chip bonding mounted in the package, the absorber functions as adhesive material for fixing a space between the surface acoustic wave filter element and the package. COPYRIGHT: (C)2004,JPO&NCIPI
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