发明名称 METHOD FOR FABRICATING MIM CAPACITOR
摘要 PURPOSE: A method for fabricating a MIM capacitor is provided to obtain a process margin in a cleaning process by forming a dielectric layer on a diffusion barrier of a metal line. CONSTITUTION: The first metal line(110a) and the second metal line(110b) are formed on a substrate(100). A diffusion barrier pattern for exposing the first metal line is formed on the substrate in order to prevent the damage of the second metal line. A dielectric layer is formed on the diffusion barrier pattern and the second metal line. A top electrode layer is formed on the dielectric layer. The first photoresist pattern is formed on the top electrode layer in order to define a capacitor region. A top electrode(140a) of a capacitor is formed by over-etching the exposed top electrode layer.
申请公布号 KR20040074769(A) 申请公布日期 2004.08.26
申请号 KR20030010165 申请日期 2003.02.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HA, SANG ROK;JUNG, JU HYEOK;KANG, GI HO;LEE, JEONG U;OH, HYEOK SANG;PARK, DAE GEUN
分类号 H01L27/04;(IPC1-7):H01L27/04 主分类号 H01L27/04
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