ELECTRONIC PACKAGE CORRECTION PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic correction process which forms a new electric correction path for connecting top vias. SOLUTION: A correction path 65 is provided between a defect net 40 and a redundancy correction net 45 in a multilayer ceramic substrate. The defect net and the correction net are terminated at top vias 41 and 46 of the substrate. The defect net is electrically isolated from an electric correction structure by the use of laser, and a post-burning circuit is formed on and in the substrate. In addition, the passivation of an electric correction line 65 is performed. COPYRIGHT: (C)2004,JPO&NCIPI