发明名称 |
Multi-chip package with soft element and method of manufacturing the same |
摘要 |
According to embodiments of the invention, a multi-chip package includes a soft element which is more elastic and flexible than the encapsulant on the sides or upper surface of the chips. Therefore, stress concentration and chip crack is prevented by ensuring vertical mobility of the chips.
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申请公布号 |
US2004163843(A1) |
申请公布日期 |
2004.08.26 |
申请号 |
US20040772651 |
申请日期 |
2004.02.04 |
申请人 |
SHIN DONG-KIL;LEE DONG-HO;MOON HO-JEONG;KIM SANG-YOUNG |
发明人 |
SHIN DONG-KIL;LEE DONG-HO;MOON HO-JEONG;KIM SANG-YOUNG |
分类号 |
H01L23/12;H01L23/10;H01L23/31;H01L25/065;(IPC1-7):H05K1/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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