发明名称 DEVICE AND METHOD FOR SUBSTRATE PROCESSING
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method in which the occurrence of particles is suppressed as much as possible while the support member of a lift pin, etc., can be prevented from transferring to the product area of a substrate. SOLUTION: Since switching is performed between air cylinders 47, 49, 48 in accordance with a type of substrate, the mark of a support pin 70 can be prevented from transferring to the product area of the substrate. Further, as the support pit 70 is driven to lift up and down on the basis of a stage 40, a drive amount of the air cylinders 47, 48, 49 can be reduced to be comparatively little and the occurrence of the particles can be suppressed as much as possible. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004241702(A) 申请公布日期 2004.08.26
申请号 JP20030031016 申请日期 2003.02.07
申请人 TOKYO ELECTRON LTD 发明人 NISHIOKA SHINJI;SAKAI MITSUHIRO;MURAKAMI TAKAHITO;TAJIRI KENICHI
分类号 H01L21/683;G02F1/13;G02F1/136;H01L21/00;H01L21/027;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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