WAFER HOLDING BODY FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE MOUNTED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body for semiconductor manufacturing device having a wafer holding surface improved in soaking property, and to provide a semiconductor manufacturing device mounted with the holding body. SOLUTION: A shaft which supports the wafer holding body having the wafer mounting surface is joined to the wafer holding body. When the surface roughness of the other surface than the joining surface of the shaft for the wafer holding device is adjusted to≤5μm in Ra, the temperature distribution on the wafer holding surface can be controlled to≤±1.0%. In addition, it is preferable to adjust the surface roughness to≤2μm in Ra. COPYRIGHT: (C)2004,JPO&NCIPI